Other Custom Jig & Device

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Other Custom Jig & Device

RAM & POT Promotion

Feature
1. Improved the quality of life time 2. Applied Gold-Coating with tribo-surface 3. Durable improvement and cost reduction.
Form of Order
1. Purpose : Transfer Mold EMC Tablet Ejection “RAM” & “POT” 2. Can be make customized according to Equipment condition and drawing of customer. 3. Application Examples (Refer to the image as below)

Spacer Wafer Promotion

● Method of shipment

1. FOSB

2. JAR

3. BOX

Feature
1. Purpose : Stack PKG Spacer Back Lap & Wafer Saw of Machine Dummy Wafer only 2. Division of Si Wafer - Reclaim Wafer : Particle 20n - Spacer / Dummy Wafer : Thickness : 750 ~ 780㎛ Thickness : 700 ~ 750㎛ Thickness : less than 700㎛

Form of Order

1. Wafer Size : (1) Diameter 12inch       (2) Diameter 8Inch
2. Wafer purpose of use : (1) Reclaim wafer      (2) Spacer wafer      (3) Dummy wafer
   - Reclaim Wafer : Used in the process of the FAB Machine Test
   - Spacer Wafer : Used in the process of the Stack PKG Assembly like MCP, e-MCP, etc.
   - Dummy Wafer : Used in the process of the Wafer Back Grinding, Wafer Saw, Wafer Stealth saw Machine Initialization Condition Set-up
3. Wafer Thickness
(1) 750~780㎛      (2) 700~750㎛      (3) less than 700㎛